Cangzhou, Hebei, China
Response Time: < 24h
Response Rate: 100%
Model No.: JCP200 | Place of Origin: China |
Equipment overview
1. Applicable: Universities, research institutes and enterprises conduct scientific research and small batch preparation of thin film new materials.
2. Product features/uses:
► The equipment can be used for both sputtering and evaporation; small footprint, cheap price, stable performance, and low maintenance costs;
► It can be used to prepare single-layer and multi-layer metal films, dielectric films, semiconductor films, magnetic films, sensor films, heat-resistant alloy films, hard films, corrosion-resistant films, etc.;
► Coating examples: silver, aluminum, copper, nickel, chromium, nichrome, titanium oxide, ITO, silicon dioxide, etc.;
► Single target sputtering, multi-target sequential sputtering, common sputtering and other functions.
Technical parameters
Model |
JCP200 |
Vacuum chamber structure |
Vertical upper opening structure, lower air extraction system, manual gas spring lift type |
Vacuum chamber size |
Φ220×H300mm |
Heating temperature |
Room temperature~500℃ |
Sputter method |
Splash up |
Rotating substrate stage |
Φ100mm |
Film thickness unevenness |
Φ50mm within≤±5.0% |
Sputtering target/evaporation electrode |
Φ2-inch one magnetron target, compatible with DC/RF sputtering |
Process gases |
1-2 way gas flow control |
Control method |
PLC touch screen control |
Area |
(Host) L600×W800×H1700mm |
Total Power |
≥6KW |